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Honflex Mobile Phone Side Key Sensor Rigid-Flex PCB is an advanced electronic solution combining traditional mechanical side keys with cutting-edge rigid-flex PCB and FPC technologies. Designed for smartphone manufacturers and buyers, it supports pressure sensing, haptic feedback, and fingerprint recognition. This core component enables ultra-thin, lightweight, waterproof, and dustproof designs while ensuring seamless aesthetics and high reliability for modern mobile devices.
Rigid Area: Designed for mounting essential sensor chips (e.g., pressure sensing ICs), control circuits, connectors, and other components requiring stable mechanical support.
Flex Area: Acts as a bridge connecting the side key area to the mainboard, capable of bending. More importantly, this area itself can be designed as a flexible sensing area that directly detects pressure.
Stiffener/Button Area: At locations requiring external contact, stainless steel sheets or FR4 stiffeners are typically placed. These transmit finger pressure, provide clear physical support, and prevent damage to the circuit board.
High Sensitivity & 3D Touch: Utilizes precision-designed capacitive sensing circuitry supporting pressure sensing and gesture recognition. Users can perform actions like volume adjustment or power on/off by simply touching specific areas on the phone's mid-frame, offering a modern touch experience.
Extreme Thinness & Flexibility: The flexible section thickness can be controlled to within 0.1mm, perfectly conforming to the curved contours of the phone's mid-frame. The rigid sections host driver ICs and passive components, achieving high integration and saving internal space.
High Reliability & Sealing: Based on a design with no mechanical openings, combined with EMI shielding technology and waterproof cover layers, the side key area achieves IP68 waterproof rating. This design effectively prevents false triggering and signal interference, enhancing the overall structural integrity of the phone.
Product Structure: 1+N+1 or 2+N+2 rigid-flex construction
Board Thickness: Flex Area: 0.12mm ± 0.02mm; Rigid Area: 0.3mm - 0.6mm
Minimum Line Width/Space: 0.05mm / 0.05mm
Sensor Type: Mutual-capacitance / Self-capacitance capacitive sensing
Operating Temperature: -40°C to +85°C
This product is primarily suitable for side power buttons, volume buttons, and gaming shoulder buttons in flagship smartphones, rugged phones, and foldable phones.
We specialize in providing industry-leading rigid-flex board solutions for mobile side key sensing applications. We offer not only standardized high-reliability products but also possess strong capabilities in collaborative design, simulation optimization, and custom development. Backed by deep expertise in precision circuit processing, materials science, and signal integrity analysis, we collaborate closely with customers to provide full-process support—from concept design to mass production—tailored to specific ID designs and stacking architectures. We are committed to leveraging innovative engineering to help customers push the boundaries of smartphone space and performance, making us your trusted core component partner.
1. What is a Honflex Mobile Phone Side Key Sensor Rigid-Flex PCB?
It’s an ultra-thin, high-precision PCB combining rigid and flexible circuits, replacing mechanical side keys with pressure-sensitive, haptic, and waterproof functions.
2. What features does it offer?
Honflex boards provide lightweight, seamless, dustproof, and waterproof designs with high reliability and optional fingerprint sensing.
3. Who can use it?
Smartphone manufacturers, ODMs, and component suppliers seeking durable and precise side key solutions.
4. Is customization available?
Yes, Honflex supports tailored designs for size, shape, sensor function, and integration with mobile devices.
5. Why choose Honflex?
With expertise in high-density design, micron-level precision, and thermal-mechanical-electrical co-simulation, Honflex ensures high signal integrity and global brand-grade quality.
For more product details or to discuss cooperation opportunities, please contact:
Ding Rui (Terry Ding), VP
Tel: +86-18750290300
Email: rding@hon-flex.com
Wang Yuhe (Rick Wang), Business Manager
Tel: +86-15959382432
Email: yhwang@hon-flex.com
Address
No. 19, Xianghai Road, Xiang'an Industrial Zone, Torch High-tech Zone, Xiamen City, China
