Tablet Fingerprint Sensor Module Rigid-Flex PCB

Tablet Fingerprint Sensor Module Rigid-Flex PCB Solution – Honflex

Honflex is a reliable China manufacturer and supplier of Tablet Fingerprint Sensor Module Rigid-Flex PCB, delivering high-performance solutions for OEM/ODM tablet projects. Our rigid-flex PCBs act as critical bridges between the mainboard and functional modules, enabling compact 3D circuit routing within limited device space.

Core Applications

• Display to Mainboard Connection: Integrated rigid-flex design reduces connectors. Flexible sections route through narrow spaces, while rigid areas support driver components.
• Fingerprint Sensor Module: Ideal for side-button fingerprint designs. The rigid section supports precise sensor placement, while the flexible circuit ensures stable signal transmission to the mainboard.
• Side Buttons & Interfaces: Power keys, volume buttons, and Type-C sub-boards use compact rigid-flex PCBs for secure mounting and efficient signal transfer.
• Antenna & Stylus Charging: Flexible layouts optimize antenna routing, while rigid sections stabilize ICs and magnetic components.

Key Advantages

• Space Optimization: Flexible circuits enable 3D routing, maximizing internal space and supporting ultra-thin tablet designs.
• High Reliability: Reduced connectors and integrated structure improve durability, vibration resistance, and long-term stability.
• Signal Integrity: EMI shielding and optimized grounding ensure stable fingerprint signal transmission with minimal interference.
• Efficient Assembly: Fewer components simplify SMT processes, reduce errors, and improve production efficiency.
• Tolerance Absorption: Flexible sections adapt to battery expansion and structural variations, maintaining reliable connections.

Key Technical Parameters:

1. Structural Parameters:

Rigid section thickness: Constrained by chip and component packaging, common thicknesses include 0.8 mm, 1.0 mm, 1.2 mm, etc.

Flexible section thickness: Pursuing extreme thinness, typically between 0.12 mm and 0.3 mm, to ensure bendability.

Rigid section layers: Depending on signal complexity, may be 4, 6, 8, or more layers.

Flexible section layers: Typically 1-2 layers, maximum 4 layers (considering bend-life requirements).

Dimensional stability: Expansion/contraction rate need to be controlled to extremely low levels (e.g., within 0.05%) to ensure rigid-flex junction alignment accuracy.

2. Electrical Performance:

Minimum trace width/spacing: Typically require 3mil/3mil (0.075mm) or even 2mil/2mil fine-line circuitry.

Minimum via diameter and pad: For HDI (High-Density Interconnect) PCBs, microvia diameter is typically 0.1 mm or smaller.

Impedance control: Common target values are 50Ω (single-ended), 90Ω (differential, e.g., USB), and 100Ω (differential, e.g., HDMI, MIPI) ±10%.

Transmission bandwidth: It supports multi-Gbps per-channel high-speed data transmission, meeting high-resolution, high-frame-rate imaging requirements.

Operating temperature: It ranges from -20°C to +70°C, meeting stringent consumer electronics usage environment requirements.

Dynamic bending: At a bending radius of R=0.5 mm, the dynamic bending endurance is ≥50,000-100,000 cycles.

Application Scenarios

The primary applications of rigid-flex PCBs in tablet computers focus on key areas requiring dynamic bending, three-dimensional routing, or space-constrained locations:

1. Connection between the Display Panel and the Mainboard

This is the most classic application scenario in tablets. The display requires substantial data transmission (e.g., video signals, touch signals) with the mainboard, connecting LCD or OLED displays to the mainboard.

2. Fingerprint Modules

The fingerprint module is typically integrated beneath the power button or in a dedicated physical button area. Given the extremely limited internal tablet space, rigid-flex PCBs can connect the fingerprint sensor (rigid section) directly to the mainboard processor through flexible circuit boards (flex section). This ensures the sensor's inherent rigid stability while flexibly routing around batteries or other components, conserving internal stacking space.

3. Battery and Power Management Circuits

The connection between battery protection boards and main power management ICs (PMIC).

Our Value and Commitment

We specialize in providing industry-leading adapter/rigid-flex PCB solutions for the mobile sector. Beyond standard high-reliability products, we possess strong collaborative design, simulation optimization, and custom development capabilities. With deep expertise in precision circuit processing, materials science, thermodynamic simulation, and signal integrity analysis, we can work closely with customers to provide full-process support from concept design to mass production delivery, tailored to specific ID designs, stacked architectures, and imaging performance objectives. We are committed to helping customers break through spatial and performance limitations of mobile imaging systems through innovative engineering technology, creating clearer, more stable, and more innovative shooting experiences. We are your trusted core component partner.

Why Choose Honflex

• Professional rigid-flex PCB factory in China
• Support OEM/ODM customization
• Competitive pricing for bulk buyers
• Stable quality with advanced precision manufacturing

Contact Us

For more product details or to discuss cooperation:

Please feel free to inquire.

Contacts:

Terry Ding (Ding Rui), VP

Tel: +86 18750290300

Email: rding@hon-flex.com

Rick Wang (Wang Yuhe), Business Manager

Tel: +86 15959382432

Email: yhwang@hon-flex.com

Website: https://www.hongflex.com